Posts Tagged: engineering substrates

IceMOS Technology Expands Semiconductor Manufacturing Capacity to Service the Increased Global Demand

Posted filed under Consumer Electronics.

Amidst an environment of increased demand and decreased capacity in the industry, IceMOS Technology Corporation today announced it has made a capital investment in its Belfast, Ireland fabrication facility to ramp production of 200mm SOI and SiSi direct bonded wafers. The move adds to its sustained production capacity for 100mm, 125mm and 150mm bonded wafers… Read more »