Package Substrates Market Highlights On Evolution 2026, says QYResearch, Inc.

Since the COVID-19 virus outbreak in December 2019, the disease has spread to almost 100 countries around the globe with the World Health Organization declaring it a public health emergency. The global impacts of the coronavirus disease 2019 (COVID-19) are already starting to be felt and will significantly affect the Package Substrate market in 2020.

COVID-19 can affect the global economy in three main ways: by directly affecting production and demand, by creating supply chain and market disruption, and by its financial impact on firms and financial markets.

The outbreak of COVID-19 has brought effects on many aspects, like flight cancellations; travel bans and quarantines; restaurants closed; all indoor events restricted; over forty countries state of emergency declared; massive slowing of the supply chain; stock market volatility; falling business confidence, growing panic among the population, and uncertainty about future.

This report also analyses the impact of Coronavirus COVID-19 on the Package Substrate industry.

The package substrate is directly used to carry the chip, which not only provides support, protection and heat dissipation for the chip, but also provides electronic connection between the chip and the PCB motherboard.

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Based on our recent survey, we have several different scenarios about the Package Substrate YoY growth rate for 2020. The probable scenario is expected to grow by a -6.9% in 2020 and the revenue will be US$7.4 billion in 2020 from US$ 7.96 billion in 2019. The market size of Package Substrate will reach US$ xx in 2026, with a CAGR of xx% from 2020 to 2026.

Figure 1.   Global Package Substrate Market Size (Value), (US$ Million), 2015 VS 2020 VS 2026

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

Figure 2.   Global Package Substrate Revenue 2015-2026 (US$ Billion)

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

According to Prismark data, the global packaging substrate market bottomed out in 2017, and it is expected that by 2022, it will reach a compound growth rate of 2.9% to reach US $ 7.74 billion. Different from the low growth rate of the global market, the output value of mainland China’s packaging substrates has increased year by year after 2012, reaching US$ 1.29 billion in 2017 (mainland output value, including domestic and oreign capital, global share of 20%). estimated 2018-2022 The annual output value of mainland packaging substrates will maintain a compound growth of more than 12%, and the industry transfer trend is obvious.

Figure 3.   China Package Substrate Output Value 2015-2026（US$ Million）

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

The packaging process can be divided into the steps of wafer cutting, wafer bonding, gold wire bonding, plastic packaging, laser printing, cutting and bending, inspection and testing.

Figure 4.   Semiconductor Packaging Process

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

According to different substrate materials, package substrates can be divided into BT and ABF.

The BT substrate can avoid leakage current and popcorn phenomenon (impacted by moisture and high temperature) in semiconductor packaging testing.

The ABF material can meet the requirements of fine lines and small line widths in line with advanced semiconductor manufacturing processes. It is suitable for ICs with high pin count and high transmission. It is mostly used in PC products such as graphics chips, processors, and chipsets.

It accounts for about 70% of the global packaging substrate market. Although ABF has great potential, the use of ABF materials requires a large amount of equipment investment, a long customer certification cycle, and a high barrier to entry.

Figure 5.   Global Package Substrate Market Size by Material Type

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

At present, semiconductor packaging is in the third stage of maturity and rapid growth, and it has entered the stage of large-scale production with major packaging forms such as BGA / CSP. At the same time, the fourth technological change with SiP and MCM as the main development direction is at the stage of incubation.

Figure 6.   Evolution of Semiconductor Packaging Technology

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

Package substrate products are diversified. From the perspective of output value distribution, in 2019, package substrates mainly include FCBGA / PGA / LGA, FCCSP, FCBOC and WBPBGA, WB CSP, RF & DigitalModule as the six main products in the package substrate market. Among them, FCBGA / PGA / LGA has a share of approximately 41% at most, and RF & DigitalModule has a minimum of approximately 13%.

Figure 7.   Global Package Substrate Market Share by Technology Type

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

The world’s top ten packaging substrate manufacturers account for more than 80% of the market share, and the industry presents an oligopoly pattern. The top three global companies UMTC, Ibiden, and SEMCO are from Taiwan, Japan, and South Korea, respectively, accounting for 14.78%, 11.19%, and 9.9% of the global market

Figure 8.   Global Package Substrate Market Share by Vendor

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

Table 1.   Global Package Substrate Top 10 Vendor Information

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

From the point of view of production, global carrier boards are mainly manufacturers in Taiwan (31%), Japan (20%), and South Korea (28%), accounting for about 80% of the global share.

Figure 9.   Global Package Substrate Manufacturing Market Share by Region

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

The package substrate serves as a carrier for chips, and its downstream requirements are highly related to IC chips. The packaging substrate is an important branch of the PCB board, which belongs to the high-end market segment, with high density, high precision, miniaturization and thinness.

It covers various social and economic fields such as communications, industrial medical, aerospace, automotive electronics, and computers. The explosion of related science and technology represented by 5G and the Internet of Things will promote the rapid development of the entire semiconductor industry chain.

Among them, the most important downstream market belongs to the field of communication. In the field of communication equipment and mobile terminals, the demand for packaging substrates accounts for 8.95% and 26.36% of its total PCB demand, respectively.

Figure 10.   Output Value of Package Substrate Accounts for Corresponding PCB market by Application

Source: Secondary Sources, Expert Interviews and QYResearch, 2020

This report presents the worldwide Package Substrates market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.

This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter’s Five Forces Analysis.

The following manufacturers are covered in this report:

• Ibiden
• Shinko Electric Industries
• Kyocera
• Samsung Electro-Mechanics
• Fujitsu
• Hitachi
• Eastern
• LG Innotek
• Simmtech
• Daeduck
• AT&S
• Unimicron
• Kinsus
• Nan Ya PCB
• ASE Group
• TTM Technologies
• Zhen Ding Technology
• Shenzhen Fastprint Circuit Tech

Package Substrates Breakdown Data by Type

• FCCSP
• WBCSP
• SiP
• BOC
• FCBGA

Package Substrates Breakdown Data by Application

• Mobile Devices
• Automotive Industry
• Others

Package Substrates Production by Region

• United States
• Europe
• China
• Japan
• South Korea
• Other Regions

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About QY Research

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